CONDUCTIVE JOINING MATERIAL AND CONDUCTIVE JOINING STRUCTURE WHICH USE METAL PARTICLES AND CONDUCTIVE MATERIAL PARTICLES

摘要

Provided are a conductive joining material and conductive joining structure which make it possible to sufficiently maintain the joining strength between two articles to be joined, by mitigating the thermal stress produced in a joining layer by adjusting the amount of thermal expansion in the joining layer to a favorable value between those of the two articles to be joined, when joining two articles to be joined by using a joining layer that uses metal nanoparticles, even when there is a difference in the thermal expansion amounts of the two articles to be joined due to a difference in the linear thermal expansion coefficients thereof, and use at high temperatures is intended. A conductive joining material containing metal nanoparticles, conductive-material micron particles, and a joining material containing organic shells comprising a solvent, wherein the linear thermal expansion coefficient of the conductive material constituting the micron particles is less than the linear thermal expansion coefficient of the metal constituting the nano particles, and the average particle diameter of the conductive-material micron particles is 0.5-10μm.