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METHOD FOR FORMING MICRO-BUMP ON METAL SURFACE
METHOD FOR FORMING MICRO-BUMP ON METAL SURFACE
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机译:在金属表面上形成微裂纹的方法
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摘要
The present invention relates to the field of laser micro-processing. Provided is a method for forming micro-bumps on a metal surface. The method comprises: sequentially, coating a bonding layer (2) onto a surface of a metal workpiece (1), punching holes on the bonding layer (2), attaching with an absorption layer (4) and covering with a transparent restraint layer (5); via laser radiation, the absorption layer (4) absorbs laser energy and generates plasma (7); the plasma (7) generates high-amplitude shock waves (8); the high-amplitude shock waves (8) pass through the bonding layer (2) and form penetrating shock waves (9); and the shock waves act on the surface of the metal workpiece (1), forming micro-bumps (10) on the surface of the metal workpiece (1) having the corresponding shape, size and distribution to the holes (3). The method is simple, reliably realizes a convex angle of the metal surface, obtains the bumps in any shape, forms a convex topography on the metal surface and strengthens the metal surface.
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