ELECTROLESS GOLD PLATING SOLUTION, ALDEHYDE-AMINE ADDUCT SUPPLY SOLUTION, AND GOLD COATING FILM FORMED USING THESE SOLUTIONS

摘要

The present invention addresses the problem of providing an electroless gold plating solution and an aldehyde-amine adduct supply solution, which are able to be stably used without causing a decrease in the plating rate associated with the accumulation of a side reaction product even in cases where the heating standby time of the electroless gold plating solution lasts for a long time.The present invention has solved the problem by an electroless gold plating solution which is characterized by containing (a) a gold cyanide salt, (b) a complexing agent, (c) an aldehyde compound and (d) an amine compound represented by general formula (1) and an aldehyde-amine adduct supply solution which is characterized by containing (c') an aldehyde compound and (d') an amine compound represented by general formula (1).R¹-NH-R² (1)(In general formula (1), each of R¹ and R² represents an electron-donating group; and if m is the number of carbon atoms (C) in each molecule and n is the number of secondary amino groups (-NH-) in each molecule, m and n satisfy 2 ≤ m ≤ 12 and n = 1.)