- ELECTROLESS GOLD PLATING SOLUTION ALDEHYDE-AMINE ADDUCT SUPPLY SOLUTION AND GOLD COATING FILM FORMED USING THESE SOLUTIONS

摘要

There is provided an electroless gold plating solution or an aldehyde-amine adduct replenishing solution which can be stably used without causing a decrease in the plating rate accompanying accumulation of side reaction products even when the waiting time of the electroless gold plating solution is prolonged for a long time In addition, An electroless gold plating solution containing (a) a cyanide gold salt and (b) a complexing agent, (c) an aldehyde compound and (d) an amine compound represented by the following general formula (1) ') Aldehyde compound and (d') an amine compound represented by the following general formula (1). R ¹ -NH-R ² (1) [In the general formula (1), R ¹ and R ² represent electron donating groups, and the number of carbon atoms (C) in the molecule is m and the number of secondary amino groups (-NH-) in the molecule is n 2 ≤ m ≤ 12, and n = 1.