HYDROPHOBIZATION TREATMENT DEVICE, HYDROPHOBIZATION TREATMENT METHOD, AND HYDROPHOBIZATION-TREATMENT RECORDING MEDIUM

摘要

The hydrophobic treatment apparatus U5 has a cooling section 40, a light irradiation section 50, a supply section 60, a lift section 80, and a control section 90. [ The cooling plate 41 of the cooling section 40 faces the back surface Wb of the wafer W. [ The light source 51a of the light irradiation part 50 faces the surface Wa of the wafer W with a gap therebetween and emits light for radiant heating. The gas receiver 61 of the supply unit 60 covers the lower side of the light source 51a and opposes the surface Wa of the wafer W with a gap therebetween. A plurality of gas discharge ports (63) are formed on the lower side of the gas receiver (61). The control unit 90 controls the supply unit 60 to send the hydrophobic processing gas while the wafer W is approaching the cooling plate 41 by controlling the elevation unit 80. [ Thereafter, the light irradiating unit 50 is controlled to emit the light source 51a, and the elevation unit 80 is controlled so that the wafer W approaches the light source, and the supply unit 60 is controlled to perform the hydrophobic treatment Gas is sent out.