MANUFACTURING METHOD OF LIGHT EMITTING DIODE HEAT RADIATING STRUCTURE HAVING MOLDED Cu-Al ALLOY POWDER WITH GREATER THAN OR EQUAL TO THERMODYNAMIC SOLID SOLUBILITY

摘要

The present invention relates to a manufacturing method of a light emitting diode (LED) heat radiating structure having molded Cu-Al alloy powder with greater than or equal to thermodynamic solid solubility. The manufacturing method of a light emitting diode (LED) heat radiating structure having molded Cu-Al alloy powder with greater than or equal to thermodynamic solid solubility comprises: a step of preparing Cu-Al alloy powder in a weight ratio of 2:8 to 8:2 of Cu to Al, which is higher than thermodynamic solid solubility; a step of controlling the Cu-Al alloy powder in an Al can; a step of extruding the Al-controlled Cu-Al alloy powder in an extruder and processing the extruded Cu-Al alloy powder into a rod member; a step of rolling the rod member into a plate member in a rolling mill; and a step of forging the rolled plate member using a press forging machine.;COPYRIGHT KIPO 2016