COPPER METAL FILM METHOD FOR PRODUCING SAME COPPER METAL PATTERN CONDUCTIVE WIRING LINE USING THE COPPER METAL PATTERN COPPER METAL BUMP HEAT CONDUCTION PATH BONDIG MATERIAL AND LIQUID COMPOSITION

摘要

Provided is a metal copper film having good substrate adhesion, low volume resistivity and deep metallicity, and a method for producing a metal copper film by reducing the metal copper film to the deep portion without damaging the substrate. The copper-based particle deposited layer containing copper oxide and a transition metal or an alloy of metal or a transition metal complex including a metal element is treated with gaseous formic acid and / or formaldehyde heated to 120 ° C or higher Wherein the copper film is a copper film. The transition metal, alloy or transition metal complex is preferably at least one element selected from the group consisting of Cu, Pd, Pt, Ni, Ag, Au, and Rh, , An alloy containing the metal, or a complex containing the metal element.