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REDUCED TRACE METALS CONTAMINATION ION SOURCE FOR AN ION IMPLANTATION SYSTEM

机译:离子注入系统中减少的痕量金属污染离子源

摘要

ion source chamber for ion implantation system 120, a housing which at least partially defined by the ionization region, to move from this ionization area high energy electrons to the cathode 124 through the housing to ionize the gas molecules injected into the inner housing; A liner section (133, 135, 137, 139) defining the inner wall of the housing one or more than the interior, each liner section including the surface to the internal exposure to the ionizing region during operation of the ion implantation system, the liner section; The cathode shield (153) disposed about the cathode; Spaced apart from the cathode repeller (180); It includes a plate 128 including a hole source 126 for emitting the ions from the ion source chamber, repeller, liner section, the cathode shield; At least one of the inserts in the plate defining the plate, or a source hole is including silicon carbide, and the silicon carbide of the formula SiC x nonstoichiometric sintered material of with an excess of carbon. ;
机译:用于离子注入系统120的离子源室,至少部分地由电离区域限定的壳体,以通过该壳体从该电离区域移动高能电子到阴极124,以使注入到内部壳体中的气体分子电离。衬里部分(133、135、137、139),该外壳部分(133、135、137、139)限定了壳体的内壁,而不是内部,该每个内衬部分包括在离子注入系统运行期间内部暴露于电离区域的表面,该衬里部分;阴极屏蔽件(153)围绕阴极设置;与阴极排斥器(180)间隔开;它包括板128,板128包括用于从离子源室,推斥极,衬套部分,阴极护罩发射离子的孔源126;限定板的板中的插入物或源孔中的至少一个包括碳化硅,以及具有过量碳的式SiC x非化学计量烧结材料的碳化硅。 ;

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