WLP UBM INDUCTOR DESIGN ON FLOATING UBM BALLS FOR WAFER LEVEL PACKAGEWLP

摘要

An inductor design for a wafer level package (WLP) does not require defrosting the solder balls on the die because the solder balls form part of the inductor. One terminal on the inductor is coupled to the die, the other terminal is coupled to a single solder ball on the die, and the remaining solder balls mechanically contacting the inductor are electrically floated. The resulting device has better inductance, direct current (DC) resistance, board-level reliability (BLR) and quality factor (Q).