LED ENCAPSULANT CONTAINING ULTRA-FAST CURING EPOXY-BASED POLYSILOXANE RESIN AND MANUFACTURING METHOD OF EPOXY-BASED POLYSILOXANE RESIN

摘要

The present invention relates to an LED encapsulant made of an ultra-high-speed curing epoxy-based polysiloxane resin and a method for producing the resin. The present invention relates to an epoxy-based polysiloxane resin which is thermally cured by using an epoxy resin having excellent refractive index and transparency, but is resistant to yellowing at a high temperature and has a short curing time, The resin is useful as an LED encapsulant having improved physical properties by maintaining a high refractive index and high transparency even at a high temperature, particularly securing heat resistance and providing an extremely fast curing time of 60 minutes or less.