首页> 外国专利> EL EL EL SURFACE SEALANT FOR OPTICAL SEMICONDUCTOR METHOD FOR MANUFACTURING ORGANIC EL DEVICE USING SAME ORGANIC EL DEVICE AND ORGANIC EL DISPLAY PANEL

EL EL EL SURFACE SEALANT FOR OPTICAL SEMICONDUCTOR METHOD FOR MANUFACTURING ORGANIC EL DEVICE USING SAME ORGANIC EL DEVICE AND ORGANIC EL DISPLAY PANEL

机译:用于使用同一有机EL器件和有机EL显示面板制造有机EL器件的光学半导体方法的EL EL EL表面密封剂

摘要

The first object is, as a resin composition for sealing an optical semiconductor, has good curability, and material of the sealing resin layer can be excellent in storage stability of the present invention; Preferably to provide a raw material of the bag is excellent weather resistance can further resin layer. The first type of optical semiconductor surface for the sealing material of the present invention, the epoxy resin (a) having two or more epoxy groups in one molecule, selected from the group consisting of Zn, Bi, Ca, Al, Cd, La, Zr at least one metal ion, comprises the metal complex (b1) containing the metal ion and a tertiary amine with a molecular weight complex ( ) form having no possible and NH coupling 17 to 200 of an anionic ligand, using an E-type viscometer, 25 , the viscosity is a measurement at 1.0rpm 10 to 10000mPa s. ;
机译:第一个目的是,作为用于密封光半导体的树脂组合物,具有良好的固化性,并且密封树脂层的材料在本发明的存储稳定性方面可以是优异的。优选提供的袋子的原料是优异的耐候性,可以进一步形成树脂层。用于本发明的密封材料的第一类型的光学半导体表面,在一个分子中具有两个或更多个环氧基的环氧树脂(a),其选自Zn,Bi,Ca,Al,Cd,La, Zr至少一种金属离子包含金属配合物(b1),该金属配合物(b1)包含金属离子和叔胺,分子量为(e)的叔胺,不可能与阴离子配体进行NH偶联17至200,使用E型粘度计参照图25,粘度是在1.0rpm 10至10000mPa s下的测量值。 ;

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