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NANO-SILVER COLLOIDAL CATALYST COMPOSITION FOR ELECTROLESS CUPPER PLATING, MANUFACTURING METHOD THEREOF, AND ELECTROLESS CUPPER PLATING METHOD USING SAME
NANO-SILVER COLLOIDAL CATALYST COMPOSITION FOR ELECTROLESS CUPPER PLATING, MANUFACTURING METHOD THEREOF, AND ELECTROLESS CUPPER PLATING METHOD USING SAME
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机译:用于无电镀铜的纳米银胶体催化剂组合物,其制备方法以及使用相同的无电镀铜方法
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摘要
The present invention relates to a technology for an Ag catalyst able to replace a Pd catalyst, which forms a nano Ag colloidal catalyst by producing colloids while dispersing Ag in nano size using organic dispersing contained material. The nano Ag colloid provides activity more than that of the Pd catalyst. Further, Ag does not create bridge, and production yield of a printed circuit board product having a microcircuit can be greatly increased. The nano Ag colloid dispersed in nano size and contained by the organic contained material can prevent a flocculation phenomenon and can cause less oxidation to increase stability of liquid, thus increase the life time of a bath. As a result, the nano Ag colloid is suitable for horizontal spray equipment.;COPYRIGHT KIPO 2016
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