BATH FOR ELECTROPLATING OF COPPER-NICKEL ALLOY AND PROCEDURE FOR APPLICATION OF GALVANIC COATING

摘要

FIELD: electroplating.;SUBSTANCE: invention relates to electroplating. Electrolyte contains salt of copper and nickel, substance, forming complexes with metals, multiple provide conductivity salts, different from each other, compound selected from group consisting of disulphide compounds of sulphur amino acids and salts thereof, compound selected from group consisting of sulphonic acids, sulphimide compounds, sulphamic acid sulphonamide compounds and salts thereof, and reaction product of simple glycidyl ether and polyatomic alcohol. Electrolyte has pH from 3 to 8. Method involves application of coating on substrate, selected from metal substrate consisting of copper, iron, nickel, silver, gold and their alloys, or from glass, ceramic, plastic substrate, with modified any of said metals or alloys surface. Coating is applied at cathodic current density from 0.01 to 5.0 A/dm².;EFFECT: technical result is increased stability of electrolyte with provision of stable coating with uniform composition.;16 cl, 6 tbl, 7 ex