Surge tank for a wet chemical method and wet chemical process for processing of semiconductor wafers with such a surge box

摘要

The present invention relates to a flush box (11, 21, 31) for a wet chemical method with a discharge chamber (2, 32, 52) for receiving a reception volume of a wet-chemical medium (7) and for the emission of the wet-chemical medium (7) through outlet openings (4) in the bottom region (5) of the discharge chamber (2, 32, 52), wherein the outlet chamber (2, 32, 52) the reception volume through the base area (5) and at the bottom region (5) adjoining side wall portions (6, 16, 56) is formed. Adjacent to at least one of the side wall portions (6, 16, 56) of the discharge chamber (2, 32, 52) is an inlet chamber (12, 22, 42) with a boundary wall region (14, 24, 44) arranged in such a way that in the case of a filling of the inlet chamber (12, 22, 42) with the wet chemical medium (7), first the inlet chamber (12) fills up to an overflow level before the wet medium (7) from the inlet chamber (12) by means of the boundary wall region (14) and / or by means of limit openings (28, 48) in the boundary wall region (24, 44) into the adjacent outlet chamber (2, 32, 52) flows. Furthermore, the invention relates to a wet chemical in - line - a process for the processing of semiconductor wafers with the surge box (11, 21, 31).