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Thickness measuring device, thick measuring method and computer program product for this purpose,

机译:为此目的的厚度测量装置,厚度测量方法和计算机程序产品,

摘要

A thickness measuring device includes a light source which emits a light; an optical system, consisting of the light, which is emitted from said light source, is focused on an optical axis; a reflector which reflects light, which is focused by the optical system; a detector, which an intensity of the reflected light according to a position on the optical axis is detected, where the light which passes through the optical system, in a focus and focal point is located; and a computing device in which a thickness of a measured object with the use of a refractive index of the measured object and a degree of a displacement between a first focal point position and a second focal point position is calculated.
机译:厚度测量装置包括发出光的光源;和由所述光源发射的光组成的光学系统聚焦在光轴上;反射器,其反射由光学系统聚焦的光;检测器,其根据光轴上的位置检测反射光的强度,检测通过光学系统的光在焦点和焦点处的位置;计算装置,其中,利用被测定物的折射率和第一焦点位置与第二焦点位置之间的位移量来计算被测定物的厚度。

著录项

  • 公开/公告号DE102015008969A1

    专利类型

  • 公开/公告日2016-01-21

    原文格式PDF

  • 申请/专利权人 MITUTOYO CORPORATION;

    申请/专利号DE20151008969

  • 发明设计人 YUTAKA MIKI;

    申请日2015-07-10

  • 分类号G01B11/06;

  • 国家 DE

  • 入库时间 2022-08-21 14:09:32

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