A process for the preparation of a circuit with a carrier, which a by means of an aluminum - silicon carbide - metal matrix composite material has surface formed

摘要

The present invention relates to a process for the production of a circuit carrier arrangement. In this case, a carrier (1) is provided, of the one hand, by an aluminium silicon carbide - metal matrix composite material has formed surface portion (1t). Also provided is a circuit carrier (2), the one insulation support (20) with an underside (20b) on which a lower metallization layer (22) is applied. On the surface portion (1t) is an adhesive layer (3) is generated, which contains a glass. Between the adhesive layer (3) and the circuit carrier (2), by means of a connecting layer (4) a cohesive material connection is established.