SELECTIVE PROCESS FOR SURFACE TREATMENT BY ATMOSPHERIC PLASMA OF ELECTRONIC CARDS FOR SINGLE FLUX-FREE BONDING OF COMPONENTS

摘要

Method for brazing connection of surface elements, in particular printed circuit boards, equipped with components, comprising a step a) plasma treatment of the surface provided for connection by brazing followed by a step b) brazing surfaces provided for connection by soldering, characterized in that step a) is performed by moving said surface elements by means of a robotic arm over a plasma torch or by moving the plasma torch under the elements of surface.