首页> 外国专利> METHOD OF FORMING LOW-DIELECTRIC-CONSTANT AMORPHOUS SILICA COATING AND LOW-DIELECTRIC-CONSTANT AMORPHOUS SILICA COATING OBTAINED BY THE METHOD

METHOD OF FORMING LOW-DIELECTRIC-CONSTANT AMORPHOUS SILICA COATING AND LOW-DIELECTRIC-CONSTANT AMORPHOUS SILICA COATING OBTAINED BY THE METHOD

机译:形成低介电常数非晶态二氧化硅涂层的方法及采用该方法获得的低介电常数非晶态二氧化硅涂层的方法

摘要

The present invention relates to an amorphous silica-based coating film with a low specific dielectric constant of 2.5 or below and the Young' s modulus of 6.0 GPa or more and having excellent hydrophobic property, and to a method of forming the same. A liquid composition containing a silicon compound obtained by hydrolyzing tetraalkyl ortho silicate (TAOS) and specific alkoxysilane (AS) in the presence of tetraalkyl ammonium hydroxide (TAAOH) is prepared. The liquid composition is then applied on a substrate, heated and cured to obtain a coating film. The coating film obtained as described has a smooth surface and also has specific micropores therein. IMAGE
机译:本发明涉及具有2.5以下的低比介电常数,6.0GPa以上的杨氏模量且疏水性优异的非晶态二氧化硅系涂膜及其形成方法。制备包含硅化合物的液体组合物,该硅化合物通过在氢氧化四烷基铵(TAAOH)存在下水解四烷基原硅酸酯(TAOS)和特定的烷氧基硅烷(AS)获得。然后将液体组合物施涂在基材上,加热并固化以获得涂膜。如上所述获得的涂膜具有光滑的表面并且其中还具有特定的微孔。 <图像>

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