Semi-aqueous stripping and cleaning formulation for metal substrate and methods for using same

摘要

Semi-aqueous formulations to remove bulk photoresists, post-etched and post-ashed residues, as well as contaminations comprises an alkanolamine, a water miscible organic co-solvent, a quaternary ammonium compound, a non-free acid functionality corrosion inhibitor, and remainder water. The pH is greater than 9 and the formulation does not contain a free acid functionality corrosion inhibitor.