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BARRIER FILM TECHNIQUES AND CONFIGURATIONS FOR PHASE-CHANGE MEMORY ELEMENTS

机译:相变存储元件的阻挡膜技术和配置

摘要

Embodiments of the present disclosure describe barrier film techniques and configurations for phase-change memory elements. In an embodiment, an apparatus includes a plurality of phase-change memory (PCM) elements, wherein individual PCM elements of the plurality of PCM elements include a bottom electrode layer, a select device layer disposed on the bottom electrode layer, a middle electrode layer disposed on the select device layer, a phase-change material layer disposed on the middle electrode layer, a top electrode layer disposed on the phase-change material layer, and a barrier film comprising a group IV transition metal, a group VI transition metal, carbon (C) and nitrogen (N), the barrier film being disposed between the bottom electrode layer and the top electrode layer. Other embodiments may be described and/or claimed.
机译:本公开的实施例描述了用于相变存储元件的阻挡膜技术和配置。在一个实施例中,一种装置包括多个相变存储器(PCM)元件,其中,多个PCM元件中的各个PCM元件包括底部电极层,设置在底部电极层上的选择器件层,中间电极层。设置在选择器件层上的相变材料层设置在中间电极层上,顶电极层设置在相变材料层上,以及包括IV族过渡金属,VI族过渡金属的阻挡膜,碳(C)和氮(N),阻挡膜设置在底部电极层和顶部电极层之间。可以描述和/或要求保护其他实施例。

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