首页> 外国专利> HIGH-RESISTIVE SILICON SUBSTRATE WITH A REDUCED RADIO FREQUENCY LOSS FOR A RADIO-FREQUENCY INTEGRATED PASSIVE DEVICE

HIGH-RESISTIVE SILICON SUBSTRATE WITH A REDUCED RADIO FREQUENCY LOSS FOR A RADIO-FREQUENCY INTEGRATED PASSIVE DEVICE

机译:射频集成无源器件具有降低的射频损耗的高电阻硅基板

摘要

The application relates to a high-resistivity silicon substrate (100) with a reduced radio frequency loss for a radio frequency integrated passive device. The substrate comprising a bulk zone (110) comprising high-resistivity bulk silicon and a preserved sub-surface lattice damage zone (120b) comprising fractured silicon above the bulk zone. The lattice damage zone is processed into the substrate and the preserved lattice damage zone is configured to achieve the RF loss reduction of the substrate by suppressing a parasitic surface conduction.
机译:本申请涉及一种用于射频集成无源器件的,具有降低的射频损耗的高电阻率硅衬底(100)。该衬底包括:包含高电阻率的块状硅的块状区域(110);以及在该块状区域上方的保留的表面下的晶格损伤区域(120b),其包括断裂的硅。晶格损伤区被加工成衬底,并且保留的晶格损伤区被配置为通过抑制寄生表面传导来实现衬底的RF损耗减小。

著录项

  • 公开/公告号EP3075007A4

    专利类型

  • 公开/公告日2017-06-07

    原文格式PDF

  • 申请/专利权人 OKMETIC OYJ;

    申请/专利号EP20140866142

  • 发明设计人 HAAPALINNA ATTE;

    申请日2014-11-26

  • 分类号H01L23/552;H01L21/02;G06K19/077;H01Q1/22;

  • 国家 EP

  • 入库时间 2022-08-21 14:04:42

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