首页> 外国专利> A STRUCTURE AND IMPLEMENTATION METHOD FOR IMPLEMENTING AN EMBEDDED SERIAL DATA TEST LOOPBACK, RESIDING DIRECTLY UNDER THE DEVICE UNDER TEST WITHIN A PRINTED CIRCUIT BOARD

A STRUCTURE AND IMPLEMENTATION METHOD FOR IMPLEMENTING AN EMBEDDED SERIAL DATA TEST LOOPBACK, RESIDING DIRECTLY UNDER THE DEVICE UNDER TEST WITHIN A PRINTED CIRCUIT BOARD

机译:一种实现嵌入式串行数据测试环回的结构和实现方法,该方法直接在打印电路板内的测试下的设备下进行

摘要

A method and a structure with multiple implementations is provided that depends on the specific need, for placing (embedding) a serial loopback circuit of known design in a printed circuit board directly beneath the device under test. Micro-vias and traces connect components including transmitter components (TX) and receiver components (RX) that are formed into a loopback circuit for connection to a device under test (DUT). The connection is accomplished by a coupling capacitor with a shortest possible electrical length approximating a straight line between said components and said DUT and said distance is a length of said short straight line times a square root of 2 so that said receiver components are beneath the DUT.
机译:提供了一种具有多种实现方式的方法和结构,其取决于特定需要,用于将已知设计的串行环回电路放置(嵌入)在直接在被测设备下方的印刷电路板上。微孔和走线连接了包括发射器组件(TX)和接收器组件(RX)在内的组件,这些组件形成了环回电路,用于连接到被测设备(DUT)。该连接由耦合电容器完成,该耦合电容器具有最短的电气长度,近似于所述组件和所述DUT之间的直线,并且所述距离是所述短直线的长度乘以2的平方根,使得所述接收器组件位于DUT下方。

著录项

  • 公开/公告号EP3194989A1

    专利类型

  • 公开/公告日2017-07-26

    原文格式PDF

  • 申请/专利权人 R&D CIRCUITS INC.;

    申请/专利号EP20150835363

  • 发明设计人 WARWICK THOMAS P.;RUSSELL JAMES V.;

    申请日2015-08-26

  • 分类号G01R31/303;

  • 国家 EP

  • 入库时间 2022-08-21 14:04:29

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