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DEVICE FOR WET-CHEMICAL TREATMENT OF OBJECTS, IN PARTICULAR OF FLAT, IN PARTICULAR DISC-SHAPED OBJECTS SUCH AS SEMICONDUCTOR WAFERS, SUBSTRATES, OR THE LIKE
DEVICE FOR WET-CHEMICAL TREATMENT OF OBJECTS, IN PARTICULAR OF FLAT, IN PARTICULAR DISC-SHAPED OBJECTS SUCH AS SEMICONDUCTOR WAFERS, SUBSTRATES, OR THE LIKE
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机译:用于对象的湿法化学处理的设备,尤其是扁平的,特殊形状的盘状对象,例如半导体晶片,基材或类似物
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摘要
The invention relates to a device for the wet-chemical treatment of objects, in of particular flat, in particular disc-shaped objects such as semiconductor wafers, substrates, or the like (12, 14) comprising a drum (10) with a loading opening (11) and a drum base (24), a holder (16, 18) for the objects (12, 14), which holder is arranged in the drum (10) rotatable around an axis of rotation, a motor (20) with a drive shaft (26) for driving the holder (16, 18), said drive shaft penetrating through the drum base (24), one or more spray nozzles (22) for spraying the objects (14) mounted in the holder (16, 18) with chemicals, and a water seal (30) arranged between the motor (20) and the drum base (24), through which water seal the drive shaft (26) of the motor (20) is guided and by which water seal the drive shaft is sealed from chemicals discharging from the drum (10).
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