首页> 外国专利> COPPER ALLOY FOR ELECTRONIC AND ELECTRICAL DEVICE, COPPER ALLOY SHEET STRIP MATERIAL FOR ELECTRONIC AND ELECTRICAL DEVICE, COMPONENT FOR ELECTRONIC AND ELECTRICAL DEVICE, TERMINAL, BUS BAR AND MOVABLE PIECE FOR RELAY

COPPER ALLOY FOR ELECTRONIC AND ELECTRICAL DEVICE, COPPER ALLOY SHEET STRIP MATERIAL FOR ELECTRONIC AND ELECTRICAL DEVICE, COMPONENT FOR ELECTRONIC AND ELECTRICAL DEVICE, TERMINAL, BUS BAR AND MOVABLE PIECE FOR RELAY

机译:电子电气设备用铜合金,电子电气设备用铜合金板带材,电子电气设备,端子,汇流排和可动件

摘要

PROBLEM TO BE SOLVED: To provide a copper alloy for electronic and electrical device excellent in conductivity, cold workability, flexure workability and castability, a copper alloy sheet strip material for electronic and electrical device, a component for electronic and electrical device, a terminal, a bus bar and a movable piece for relay.SOLUTION: A copper alloy for electronic and electrical device contains Mg in a range of 0.15 mass% or more and less than 0.35 mass%, P in a range of 0.0005 mass% or more and less than 0.01 mass% and the balance Cu with inevitable impurities and has conductivity of over 75%IACS, content of Mg [Mg] (mass%) and content of P [P] (mass%) satisfying a relational expression of [Mg]+20×[P]0.5, content of H of 10 mass.ppm or less, content of O of 100 mass.ppm or less, content of S of 50 mass.ppm or less and content of C of 10 mass.ppm or less.SELECTED DRAWING: None
机译:解决的问题:提供具有优异的导电性,冷加工性,挠曲加工性和浇铸性的电子电气设备用铜合金,电子电气设备用铜合金薄板带材,电子电气设备用部件,端子,解决方案:用于电子和电气设备的铜合金包含的Mg含量在0.15质量%以上且小于0.35质量%,P含量在0.0005质量%以上且以下小于0.01质量%,余量的铜具有不可避免的杂质,电导率超过75%IACS,Mg [Mg](质量%)的含量和P [P](质量%)的含量满足[Mg] +的关系式20×[P] <0.5,H的含量为10质量ppm以下,O的含量为100质量ppm以下,S的含量为50质量ppm以下,C的含量为10质量ppm以下。更少。

著录项

  • 公开/公告号JP2017186662A

    专利类型

  • 公开/公告日2017-10-12

    原文格式PDF

  • 申请/专利权人 MITSUBISHI MATERIALS CORP;

    申请/专利号JP20170063258

  • 发明设计人 MATSUNAGA HIROTAKA;MAKI KAZUMASA;

    申请日2017-03-28

  • 分类号C22C9;H01B1/02;H01B5/02;C22F1/08;C22F1;

  • 国家 JP

  • 入库时间 2022-08-21 14:01:48

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