首页> 外国专利> RESIN COMPOSITION FOR FORMING TRANSPARENT HEAT INSULATION LAYER, AND TRANSPARENT HEAT INSULATION LAYER AND TRANSPARENT HEAT INSULATION FILM USING THE SAME

RESIN COMPOSITION FOR FORMING TRANSPARENT HEAT INSULATION LAYER, AND TRANSPARENT HEAT INSULATION LAYER AND TRANSPARENT HEAT INSULATION FILM USING THE SAME

机译:用于形成透明隔热层的树脂组合物,以及使用相同的透明隔热层和透明隔热膜的树脂组合物

摘要

PROBLEM TO BE SOLVED: To simply manufacture and provide a transparent heat insulation film which has low thermal conductivity, is excellent in heat insulation properties, and has higher visibility.SOLUTION: There are provided a resin composition for forming transparent heat insulation layer which contains silica fine particles (A) surface-modified with a compound having a phenyl group, polysilane (B) having a unit represented by general formula (1), and an ionizing radiation curable resin composition (C) and an oil-soluble azo polymerization initiator (D), where as for a content ratio with respect to the total solid content in the composition, the polysilane (B) is 0.1-10 mass%, the ionizing radiation curable resin composition (C) is 4-50 mass%, and the oil-soluble azo polymerization initiator (D) is 10-30 mass%; and a transparent heat insulation film 10 has a transparent heat insulation layer 2 formed thereon by applying and curing of the resin composition for forming transparent heat insulation layer onto a transparent base material 1.SELECTED DRAWING: Figure 1
机译:解决的问题:为了简单地制造并提供具有低导热率,优异的隔热性质并且具有更高的可见性的透明隔热膜。解决方案:提供了一种用于形成透明隔热层的包含二氧化硅的树脂组合物。用具有苯基的化合物,具有通式(1)表示的单元的聚硅烷(B),电离辐射固化性树脂组合物(C)和油溶性偶氮聚合引发剂进行表面改性的微粒(A)( D)相对于组合物中的总固体成分的含有比例,聚硅烷(B)为0.1〜10质量%,电离放射线固化性树脂组合物(C)为4〜50质量%,油溶性偶氮聚合引发剂(D)为10〜30质量%。透明绝热膜10具有在其上形成的透明绝热层2,该透明绝热层2是通过在透明基材1上涂布形成透明绝热层的树脂组合物并使其固化而形成的。

著录项

  • 公开/公告号JP2017014330A

    专利类型

  • 公开/公告日2017-01-19

    原文格式PDF

  • 申请/专利权人 TOPPAN PRINTING CO LTD;

    申请/专利号JP20150129654

  • 发明设计人 NAKAYAMA YUMI;

    申请日2015-06-29

  • 分类号C08F2/44;C08F291/16;B32B7/02;B32B27;

  • 国家 JP

  • 入库时间 2022-08-21 14:01:50

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