首页> 外国专利> SURFACE-TREATED COPPER FOIL FOR PRINTED-WIRING BOARD, COPPER PLATED LAMINATE SHEET FOR PRINTED-WIRING BOARD, AND PRINTED-WIRING BOARD

SURFACE-TREATED COPPER FOIL FOR PRINTED-WIRING BOARD, COPPER PLATED LAMINATE SHEET FOR PRINTED-WIRING BOARD, AND PRINTED-WIRING BOARD

机译:印刷线路板的表面处理铜箔,印刷线路板的铜镀铜层压板和印刷线路板

摘要

PROBLEM TO BE SOLVED: To provide a surface-treated copper foil for a printed-wiring board, in which a transmission loss is highly suppressed even at the time of transmitting a high frequency signal of the GHz band, which is highly adhesive between a copper foil and a resin substrate at a high temperature and excellent in durability under a severe condition, and which is hardly-short-circuited.;SOLUTION: A surface-treated copper foil for a printed-wiring board has a silane coupling agent layer on the surface formed with roughening particles. In said silane coupling agent layer, the average height of roughening particles is 0.05 μm or more and less than 0.5 μm, and the BET surface area ratio of said silane coupling agent layer is 1.2 or more.;SELECTED DRAWING: None;COPYRIGHT: (C)2017,JPO&INPIT
机译:要解决的问题:提供一种用于印刷线路板的表面处理铜箔,即使在传输GHz频段的高频信号时,其传输损耗也得到高度抑制,这在铜之间具有很高的粘合性箔和树脂基材在高温下和在苛刻条件下的耐久性极好,并且几乎不短路。解决方案:用于印刷线路板的表面处理铜箔在其表面上具有硅烷偶联剂层表面形成有粗糙的颗粒。在所述硅烷偶联剂层中,所述粗糙化粒子的平均高度为0.05μm以上且小于0.5μm,所述硅烷偶联剂层的BET表面积比为1.2以上。 C)2017,日本特许厅

著录项

  • 公开/公告号JP2017106068A

    专利类型

  • 公开/公告日2017-06-15

    原文格式PDF

  • 申请/专利权人 FURUKAWA ELECTRIC CO LTD:THE;

    申请/专利号JP20150240006

  • 发明设计人 SAITO TAKAHIRO;EZURA KEN;

    申请日2015-12-09

  • 分类号C23C26;B32B15/04;C25D7/06;H05K3/38;H05K1/09;C25D5/16;

  • 国家 JP

  • 入库时间 2022-08-21 14:00:23

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