首页> 外国专利> SILICA-BASED COMPOSITE FINE PARTICLE-DISPERSED LIQUID, METHOD FOR PRODUCING THE SAME, AND SLURRY FOR POLISHING CONTAINING SILICA-BASED COMPOSITE FINE PARTICLE-DISPERSED LIQUID

SILICA-BASED COMPOSITE FINE PARTICLE-DISPERSED LIQUID, METHOD FOR PRODUCING THE SAME, AND SLURRY FOR POLISHING CONTAINING SILICA-BASED COMPOSITE FINE PARTICLE-DISPERSED LIQUID

机译:二氧化硅基复合细颗粒分散液,其制备方法和抛光含二氧化硅的复合细颗粒分散液的浆液

摘要

PROBLEM TO BE SOLVED: To provide a silica-based composite fine particle-dispersed liquid capable of performing polishing at a high speed even to an Si wafer and the material hard to be worked, simultaneously capable of attaining high face accuracy (such as a low scratch), and further capable of preferably being used for the polishing of the surface of a semiconductor device such as a semiconductor substrate and a wiring board.;SOLUTION: Provided is a silica-based composite fine particle-dispersed liquid containing silica-based composite fine particles in which the surface of a mother particle essentially consisting of amorphous silica is coupled with a child particle essentially consisting of crystalline ceria, having the following characteristics: that the mass ratio between the mother particle and the child particle is 100:11 to 316; that, when it is fed to X-ray diffraction, only the crystal phase of ceria is detected; that, when it is fed to X-ray diffraction, the crystallite diameter of the (111) face in the crystalline ceria is 10 to 25 nm; that the piece ratio of the particles in which the ratio between the minor axis/major axis measured by an image analysis method is 0.8 or lower is 50% or higher; and that the contents of Na or the like are 100 ppm or lower, respectively.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2017,JPO&INPIT
机译:要解决的问题:提供一种二氧化硅基复合细颗粒分散液,该分散液能够对硅晶片和难以加工的材料进行高速抛光,同时能够实现较高的表面精度(例如低划痕),并且还能够更好地用于半导体器件(如半导体衬底和接线板)的表面抛光。;解决方案:提供了一种含二氧化硅基复合材料的二氧化硅基复合微粒分散液具有基本由无定形二氧化硅组成的母颗粒的表面与基本由结晶二氧化铈组成的子颗粒结合的细颗粒,其具有以下特征:母颗粒与子颗粒之间的质量比为100:11至316 ;当将其送入X射线衍射时,仅检测到二氧化铈的结晶相。当进行X射线衍射时,结晶二氧化铈中(111)面的微晶直径为10至25nm。通过图像分析方法测得的短轴/长轴之比为0.8以下的颗粒的片比为50%以上; Na等的含​​量分别为100 ppm以下。;选图:图1;版权:(C)2017,JPO&INPIT

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