NOVEL LATENT CURING AGENT FOR EPOXY RESIN AND ONE PACK TYPE EPOXY RESIN COMPOSITION CONTAINING THE LATENT CURING AGENT

摘要

PROBLEM TO BE SOLVED: To provide a latent curing agent capable of providing a sufficient curing rate even at low curing temperature and providing a one pack type epoxy resin composition good in storage stability.;SOLUTION: A latent curing agent capable of solving the problem can be provided by reacting an epoxy resin composition containing a bisphenol type epoxy resin with an epoxy equivalent of 160 to 200 g/eq. of 1 to 20 wt.% and also containing a bisphenol type epoxy resin with an epoxy equivalent of 750 to 6000 g/eq. and a novolak type epoxy resin, with an amine compound.;SELECTED DRAWING: None;COPYRIGHT: (C)2018,JPO&INPIT