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HEAT CONDUCTION MEMBER, MANUFACTURING METHOD FOR HEAT CONDUCTION MEMBER, AND HEAT CONDUCTION STRUCTURE

机译:导热构件,导热构件的制造方法以及导热结构

摘要

PROBLEM TO BE SOLVED: To provide a heat conduction member that makes it possible to prevent a metal layer from being turned up even when the member moves in a direction of the member being pressed and rubbed on a surface of the metal layer in disposing the member so as to be in contact with the metal layer.SOLUTION: A heat conduction member includes a laminate constructed by stacking a resin layer with a metal layer. The resin layer is constructed from heat-conductive resin material. The laminate's thickness at the periphery of the laminate is made to be thinner than that at the center part of the laminate; the laminate's thickness at intermediate part of the laminate is thicker than that at the center part of the laminate. On the laminate, an inclined surface having a downward pitch from the intermediate part to the periphery is constructed.SELECTED DRAWING: Figure 1
机译:解决的问题:提供一种导热构件,该导热构件即使在构件在布置构件时被按压并在金属层的表面上摩擦的方向上移动时也能够防止金属层翘起。解决方案:导热构件包括通过将树脂层与金属层堆叠而构成的层压板。树脂层由导热树脂材料构成。使层叠体的周围的层叠体的厚度比层叠体的中央部的厚度薄。叠层中部的叠层厚度比叠层中部的厚度厚。在层压板上,构造了一个倾斜面,该倾斜面从中间部分到外围具有向下的间距。

著录项

  • 公开/公告号JP2017183349A

    专利类型

  • 公开/公告日2017-10-05

    原文格式PDF

  • 申请/专利权人 KITAGAWA KOGYO CO LTD;

    申请/专利号JP20160064262

  • 发明设计人 MIZUNO TAKASHI;YUMI HIDEO;

    申请日2016-03-28

  • 分类号H01L23/36;H05K7/20;

  • 国家 JP

  • 入库时间 2022-08-21 13:58:57

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