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Heat conduction member, production method for heat conduction member, and heat conduction structure

机译:导热构件,导热构件的制造方法以及导热结构

摘要

The heat conduction member comprises a laminate formed by laminating a resin layer and a metal layer. The resin layer is formed from a thermally conductive resin material. The thickness of the laminate is smaller at the peripheral edge of the laminate than in the center portion of the laminate, and the thickness of the laminate is greater in the intermediate portion of the laminate than in the center portion of the laminate. An inclined surface is formed on the laminate so as to form a falling gradient from the intermediate portion toward the peripheral edge.
机译:导热构件包括通过层压树脂层和金属层而形成的层压体。树脂层由导热树脂材料形成。叠层的厚度在叠层的周缘比在叠层的中央部分小,并且叠层的厚度在叠层的中间部分比在叠层的中心部分大。在层压体上形成倾斜表面,以形成从中间部分到周缘的下降梯度。

著录项

  • 公开/公告号US10132575B2

    专利类型

  • 公开/公告日2018-11-20

    原文格式PDF

  • 申请/专利权人 KITAGAWA INDUSTRIES CO. LTD.;

    申请/专利号US201715471336

  • 发明设计人 TAKASHI MIZUNO;HIDEO YUMI;

    申请日2017-03-28

  • 分类号F28F13/18;F28F21/06;F28F21/08;H01L23/31;H01L23/373;

  • 国家 US

  • 入库时间 2022-08-21 12:10:44

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