PRIOR-SUPPLY TYPE UNDERFILL MATERIAL, METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE, AND ELECTRONIC COMPONENT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a prior-supply type underfill material that can shorten curing time, reduces voids, and has excellent adhesion to an electronic component.;SOLUTION: A prior-supply type underfill material has (A) a compound having an ethylenic unsaturated double bond, (B) a reaction initiator, (C) an inorganic filler, and (D) a flexing agent. The (A) compound having an ethylenic unsaturated double bond has (A1) an adduct of epoxy resin and (meth) acrylic acid.;SELECTED DRAWING: None;COPYRIGHT: (C)2017,JPO&INPIT