PRIOR-SUPPLY TYPE UNDERFILL MATERIAL, ELECTRONIC COMPONENT DEVICE AND METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a prior-supply type underfill material that has a high rate of curing reaction in a high-temperature region, while having excellent heat stability in a medium-temperature region to inhibit the start of reaction, and an electronic component device comprising the same and a method for producing the same.SOLUTION: A prior-supply type underfill material has a radical-polymerizable compound, a radical polymerization initiator, and an inorganic filler having a group having an unsaturated double bond or an inorganic filler surface-treated with a compound having an unsaturated double bond.SELECTED DRAWING: None