A die package comprising a die-to-wire connector and a wire-to-die connector configured to couple to the die package

摘要

Some novel features relate to an integrated device package (eg, a die package) that includes a package substrate, a die, an encapsulation layer, and a first set of metal layers. The package substrate includes a first surface and a second surface. The die is bonded to the first surface of the package substrate. The encapsulation layer encapsulates the die. The first set of metal layers is bonded to the first outer surface of the encapsulation layer. In some implementations, the first set of metal layers is configured to operate as a die-to-wire connector of an integrated device package. In some implementations, the integrated device package includes a second set of metal layers coupled to the second surface of the package substrate. In some implementations, the integrated device package includes a second set of metal layers coupled to the second outer surface of the encapsulation layer.