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Method of lead forming lead part and lead forming apparatus of lead part

机译:引线形成引线部的方法及引线部的引线形成装置

摘要

PROBLEM TO BE SOLVED: To provide a lead shaping method and a lead shaping device capable of preventing a lead component having burr from dropping after being shaped when supplying the lead component.SOLUTION: A lead shaping method includes a mounting step for mounting the electronic component body 901 of a lead component 900 at the head, out of arranged lead components 900, on a mounting part 22 movable in the supply direction, a lead shaping step for clamping and shaping a lead extending from the lead component 900, mounted on the mounting part 22, by means of the clamp members 23a, 24a provided in the mounting part 22, and a component separation step for separating the lead component 900 at the head from the following lead components 900, by moving the mounting part 22 while clamping the lead by means of the clamp members 23a, 24a.
机译:解决的问题:提供一种引线成形方法和引线成形装置,该引线成形方法和引线成形装置能够在供应引线部件时防止成形后的毛刺引线部件掉落。解决方案:引线成形方法包括用于安装电子部件的安装步骤。头部的引线组件900的主体901在布置的引线组件900中,在可沿供应方向移动的安装部件22上,进行引线成形步骤,用于夹紧和成形从引线组件900延伸的引线,该引线成形步骤安装在安装架上借助于设置在安装部分22中的夹持构件23a,24a,以及通过在夹持引线的同时移动安装部分22来使头部的引线组件900与随后的引线组件900分离的组件分离步骤通过夹紧构件23a,24a。

著录项

  • 公开/公告号JP6161466B2

    专利类型

  • 公开/公告日2017-07-12

    原文格式PDF

  • 申请/专利权人 富士機械製造株式会社;

    申请/专利号JP20130169425

  • 发明设计人 松田 太志;大坪 覚;

    申请日2013-08-19

  • 分类号H01L23/50;

  • 国家 JP

  • 入库时间 2022-08-21 13:57:31

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