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Deposition of copper-tin and copper-tin-zinc alloy from electrolyte

机译:电解液中铜锡和铜锡锌合金的沉积

摘要

The present invention relates to a cyanide-free electrolyte comprising phosphoric acid and an aliphatic or aromatic thio compound and to a process for the electrolytic deposition of elemental copper, tin and optionally zinc containing alloys is there. In these electrolytes and processes, the electrolyte used contains stannate ions, copper ions and optionally zinc (II) ions, as well as aliphatic and / or aromatic thio compounds. The electrolyte may additionally contain a carboxylic acid, a humectant and / or a brightening agent. The present invention further provides a process for electrolytically depositing alloys of copper, tin, and optionally zinc on consumer goods and accessories using the electrolyte of the present invention.
机译:本发明涉及包含磷酸和脂族或芳族硫代化合物的无氰化物电解质,并且涉及其中电解沉积元素铜,锡和任选地含锌合金的方法。在这些电解质和方法中,所使用的电解质包含锡酸根离子,铜离子和任选的锌(II)离子,以及脂族和/或芳族硫代化合物。电解质可以另外包含羧酸,保湿剂和/或增白剂。本发明进一步提供了使用本发明的电解质在消费品和附件上电解沉积铜,锡和任选地锌的合金的方法。

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