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Multilayer solder material for joining different types of electrodes and method for joining different types of electrodes of electronic parts
Multilayer solder material for joining different types of electrodes and method for joining different types of electrodes of electronic parts
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机译:用于接合不同类型的电极的多层焊料材料以及用于接合电子部件的不同类型的电极的方法
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摘要
When soldering a package having an electrode on which Ni/Au or Ag-Pd alloy is plated to a printed circuit board having a Cu electrode or an electrode on which Cu is plated, a solid-phase diffusion layer is formed within the inside of a layered solder material for bonding different species of electrodes by heating and cooling the layered solder material for bonding different species of electrodes. The layered solder material is composed of a solder material of Sn-Ag-Cu series or Sn-Sb series and a solder material of Sn-Ag-Cu-Ni series or Sn-Pb series. The electrode on which Ni/Au or Ag-Pd alloy is plated and the Cu electrode or the electrode on which Cu is plated are soldered with the solder material of Sn-Ag-Cu series or Sn-Sb series being attached to the Cu electrode and the solder material of Sn-Ag-Cu-Ni series or Sn-Cu series being attached to the electrode on which Ni/Au or Ag-Pd alloy is plated. This allows formation of intermetallic compounds to be restrained, thereby soldering them with high bonding reliability.
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