首页> 外国专利> METHOD FOR MEASURING PLATING THICKNESS OF PLATING MATERIAL, METHOD FOR MEASURING AMOUNT OF CORROSION OF PLATING MATERIAL, AND CORROSION SENSOR OF PLATING MATERIAL

METHOD FOR MEASURING PLATING THICKNESS OF PLATING MATERIAL, METHOD FOR MEASURING AMOUNT OF CORROSION OF PLATING MATERIAL, AND CORROSION SENSOR OF PLATING MATERIAL

机译:电镀材料的镀层厚度的测定方法,电镀材料的腐蚀量的测定方法以及电镀材料的腐蚀传感器

摘要

PROBLEM TO BE SOLVED: To provide a method for measuring the plating thickness of a plating material in which a conductive plating layer is formed on a conductive base material precisely nondestructively.;SOLUTION: A method for measuring the plating thickness of a plating material includes the steps of: measuring impedance of a plating material having a base material and a plating layer using an AC power supply of a frequency within the range of a frequency greater than the frequency at which a skin effect appears in the base material and a frequency less than the frequency at which a skin effect appears in the plating layer, and calculating the plating thickness of the plating material based on the resistance of the impedance.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2017,JPO&INPIT
机译:解决的问题:提供一种测量镀覆材料的镀覆厚度的方法,其中在导电基材上精确无损地形成导电镀层。解决方案:一种测量镀覆材料的镀覆厚度的方法包括:步骤:使用交流电源来测量具有基材和镀层的电镀材料的阻抗,该交流电源的频率应大于在基材中出现集肤效应的频率和小于集肤效应的频率镀层出现集肤效应的频率,并基于阻抗的电阻计算镀层材料的镀层厚度。;选定的图纸:图1;版权:(C)2017,JPO&INPIT

著录项

  • 公开/公告号JP2017003372A

    专利类型

  • 公开/公告日2017-01-05

    原文格式PDF

  • 申请/专利权人 JFE STEEL CORP;

    申请/专利号JP20150116256

  • 发明设计人 KAJIYAMA HIROSHI;TSURU TORU;KONO TAKASHI;

    申请日2015-06-09

  • 分类号G01B7/06;G01N27/04;G01N27/00;

  • 国家 JP

  • 入库时间 2022-08-21 13:55:54

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