Composite wafer manufacturing method using laser processing and temperature induced stress

摘要

The present invention relates to a method for producing a layer of solid material. The method according to the invention provides a solid material (2) for separating at least one layer of solid material (4) and at least one radiation source, in particular one laser, to form a layer of solid material. In order to determine the separation surface to be separated from the solid object, to generate a defect in the internal structure of the solid object and to generate stress, in particular mechanically, in the solid object (2), Heat is applied to the polymer layer (10) disposed on the solid (2), and cracks propagate in the solid object (2) along the separation surface (8) due to the stress. The crack includes at least a layer separating the solid material (4) from the solid material (2). [Selection] Figure 1