End point detecting device, end point detecting method and electron beam irradiation processing device of electron beam irradiation processing

摘要

PROBLEM TO BE SOLVED: To provide an end-point detecting apparatus, an end-point detecting method and an electron beam irradiation processing apparatus capable of highly accurately detecting an end-point of processing without making configuration and operation of the apparatus complicated in the electron beam irradiation processing.SOLUTION: An end-point detecting apparatus for electron beam irradiation processing includes: a first electron beam irradiation unit 12 for irradiating a processing region on an object to be processed, as a processing target of electron beam irradiation, with an electron beam 2; a second electron beam irradiation unit 12' for irradiating an end-point detecting region having an expanded shape similar to a shape of the processing region with an electron beam in synchronization with an irradiation timing of the electron beam 2; a capturing unit 10' for capturing secondary electrons or back scattered electrons generated from the end-point detecting region; and a calculation unit 20 for calculating an end-point of the electron beam irradiation processing on the end-point detecting region on the basis of strength of the captured secondary electrons or back scattered electrons, and also for calculating a point at the calculated end-point as an end-point of the electron beam irradiation processing.