Phenol resin, epoxy resin composition containing the phenol resin, cured product of the epoxy resin composition, and semiconductor device having the cured product

摘要

A phenolic resin represented by the general formula (1), which is cured at a temperature of not less than 40 C. and not more than 180 C. to a cured product obtained from the phenolic resin, the epoxy resin represented by the general formula (2) , It gives a thermal expansion coefficient of 1.5% or more. It is preferable that the phenolic resin imparts a storage modulus of elasticity of 15 MPa or more at 250 C. to the cured product.