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Processing apparatus of the ceramic material, the processing method of evaluating ceramics material

机译:陶瓷材料的加工装置,评价陶瓷材料的加工方法

摘要

PROBLEM TO BE SOLVED: To prevent troubles caused by failure found in the last stage, by evaluating the formation of a split groove.;SOLUTION: A processing device for ceramic materials comprises: a laser device irradiating a laser beam which processes a ceramic material; a drive unit which moves a relative position between the ceramic material and the laser beam; a laser processing beam detector which detects a laser processing beam of the ceramic material; a laser processing beam diameter measuring part which measures a diameter of the laser processing beam detected by the laser processing beam detector.;COPYRIGHT: (C)2014,JPO&INPIT
机译:解决的问题:通过评估裂口的形成,防止在最后阶段发现由故障引起的故障。解决方案:用于陶瓷材料的处理设备包括:照射激光束的激光设备,该激光束对陶瓷材料进行处理;驱动单元,其在陶瓷材料和激光束之间移动相对位置;激光加工光束检测器,其检测陶瓷材料的激光加工光束。激光加工光束直径测量部件,用于测量由激光加工光束检测器检测到的激光加工光束的直径。;版权:(C)2014,JPO&INPIT

著录项

  • 公开/公告号JP6042685B2

    专利类型

  • 公开/公告日2016-12-14

    原文格式PDF

  • 申请/专利权人 KOA株式会社;

    申请/专利号JP20120217334

  • 发明设计人 加藤 俊;松本 健太郎;

    申请日2012-09-28

  • 分类号H05K3/00;B23K26/00;B28D7/00;

  • 国家 JP

  • 入库时间 2022-08-21 13:54:50

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