Polyimide film and manufacturing method thereof, flexible printed circuit board, substrate for flexible display, front plate for flexible display, LED lighting device and organic electroluminescence display device

摘要

An object of the present invention is to provide a polyimide film having improved light transmission, coloring resistance and low-temperature bending resistance suitable for a flexible printed circuit board of an LED lighting device and the like, a manufacturing method thereof, a flexible printed circuit board using the polyimide film, and a flexible display. It is to provide a base material for use, a front plate for flexible display, an LED lighting device, and an organic electroluminescence display device. The polyimide film of the present invention is a polyimide film having a polyamic acid or a polyimide formed by a diamine or derivative thereof and an acid anhydride or derivative thereof, one of which has a fluorene skeleton, After humidity adjustment for 12 hours in an environment of% RH, the film is immersed in pure water at 23 ° C., and the film elongation rate S in the range of 0.01 to 0.10% / min after 2 minutes from the time of immersion is in the range of 0.01 to 0.10% / minute. It is characterized by that.