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Mounting management device, mounting processing device, mounting system, mounting management method and mounting processing method

机译:安装管理装置,安装处理装置,安装系统,安装管理方法及安装处理方法

摘要

In the electronic component mounting system 10, the mounting management server 60 acquires measured information related to the result of measuring the component P accommodated in the reel 55, and device information 72 in which the acquired measured information is registered in association with the reel ID. In the mounting process, measured information corresponding to the reel 55 is output to the mounting machine 21. Further, the mounting processing apparatus 20 receives device information for registering measured information related to the result of measuring the component P accommodated in the reel 55 in association with the reel ID, and the measured information is included in the device information of the component to be mounted. In some cases, component mounting processing is executed.
机译:在电子部件安装系统10中,安装管理服务器60获取与容纳在卷盘55中的部件P的测量结果有关的测量信息,以及与卷盘ID相关联地登记所获取的测量信息的设备信息72。在安装过程中,与卷盘55相对应的测量信息被输出到安装机21。此外,安装处理设备20接收用于登记测量信息的设备信息,该测量信息与测量容纳在卷盘55中的部件P相关联。带有卷轴ID,并且测量信息包含在要安装的组件的设备信息中。在某些情况下,执行组件安装处理。

著录项

  • 公开/公告号JPWO2014203331A1

    专利类型

  • 公开/公告日2017-02-23

    原文格式PDF

  • 申请/专利权人 富士機械製造株式会社;

    申请/专利号JP20150522402

  • 发明设计人 柴田 光彦;

    申请日2013-06-18

  • 分类号H05K13;H05K13/04;

  • 国家 JP

  • 入库时间 2022-08-21 13:54:02

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