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Mounting management device, mounting processing device, mounting system, mounting management method and mounting processing method

机译:安装管理装置,安装处理装置,安装系统,安装管理方法及安装处理方法

摘要

In an electronic component mounting system 10, a mounting management server 60 acquires measurement information relating to a result obtained by measurement of a component P which is stored in a reel 55, registers the acquired measured information in the device information 72 in association with a reel ID, and outputs the measurement information corresponding to the reel 55 to a mounting machine 21 during a mounting process. The mounting process device 20 receives the device information in which the measurement information that relates to the result obtained by measuring the component P stored in the reel 55 and that is associated with the reel ID is registered, when the measurement information is present in the device information of the component to be mounted, the mounting process device 20 executes the mounting process of the component.
机译:在电子部件安装系统10中,安装管理服务器60获取与通过卷盘55中存储的部件P的测量获得的结果有关的测量信息,并将获取的测量信息与卷盘相关联地注册在设备信息72中。并在安装过程中将与卷轴55对应的测量信息输出到安装机21。当处理信息存在于设备中时,安装处理设备20接收设备信息,在该设备信息中,登记有与通过测量存储在卷盘55中的部件P而获得的结果有关的,与卷盘ID相关联的测量信息。待安装部件的信息,安装处理装置20执行部件的安装处理。

著录项

  • 公开/公告号JP6272325B2

    专利类型

  • 公开/公告日2018-01-31

    原文格式PDF

  • 申请/专利权人 富士機械製造株式会社;

    申请/专利号JP20150522402

  • 发明设计人 柴田 光彦;

    申请日2013-06-18

  • 分类号H05K13;H05K13/04;

  • 国家 JP

  • 入库时间 2022-08-21 13:07:07

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