Liquid composition for cleaning and removing deposits containing copper from the surface of oxide (IGZO) composed of indium, gallium, zinc, and oxygen, IGZO surface cleaning method using the liquid composition, and cleaning method therefor Substrate cleaned by

摘要

The present invention is a liquid composition that cleans and removes copper-containing deposits from the surface of an oxide (IGZO) made of indium, gallium, zinc, and oxygen without corroding the IGZO semiconductor layer and the wiring containing copper. And a method of cleaning the surface of IGZO using the liquid composition, and a substrate cleaned by the cleaning method. In the present invention, a liquid composition containing at least one selected from the group consisting of hydroxycarboxylic acids and dicarboxylic acids or salts thereof and having a pH value of 1.5 to 10 is used.