Pickup device and push-up pot

摘要

This specification discloses a pickup device having a push-up pot for pushing up a semiconductor chip adhered to the upper surface of the film from below. In the pickup device, an identification mark is attached to the side surface portion of the push-up pot. This specification also discloses a push-up pot used to push up a semiconductor chip adhered to the upper surface of a film in a pickup device from below. In the push-up pot, an identification mark is attached to the side face portion.