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Low Cost Apparatus for Insitu Testing of Packaged Integrated Circuits During Stressing
Low Cost Apparatus for Insitu Testing of Packaged Integrated Circuits During Stressing
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机译:用于在应力下对封装的集成电路进行原位测试的低成本设备
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摘要
An apparatus with a burn-in board containing a microcontroller unit and a heater socket for insitu testing of a packaged integrated circuit while under stress. A method for insitu testing of a packaged integrated circuit while under stress. A method for insitu testing of multiple packaged integrated circuits while under stress.
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