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Au-containing layer for charged particle beam processing
Au-containing layer for charged particle beam processing
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机译:用于带电粒子束加工的含金层
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摘要
The invention provides a method for providing an Au-containing layer onto a surface of a work piece, which method comprises:providing 510 a deposition fluid comprising Au(CO)Cl;depositing 520 the fluid on at least part of the surface of the work piece; anddirecting 530 a charged particle beam toward the surface of the work piece onto which at least part of the fluid is deposited to decompose Au(CO)Cl thereby forming the Au-containing layer on the surface of the work piece.;By using Au(CO)Cl as a precursor for charged particle induced deposition, a gold Au layer may be deposited with a very high purity compared to methods known in the art.
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