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Designed asperity contactors, including nanospikes, for semiconductor test using a package, and associated systems and methods
Designed asperity contactors, including nanospikes, for semiconductor test using a package, and associated systems and methods
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机译:设计的粗糙接触器,包括纳米钉,用于使用封装进行半导体测试,以及相关的系统和方法
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摘要
Nanospike contactors suitable for semiconductor device test, and associated systems and methods are disclosed. A representative apparatus includes a package having a wafer side positioned to face toward a device under test and an inquiry side facing away from the wafer side. A plurality of wafer side sites are carried at the wafer side of the package. The nanospikes can be attached to nanospike sites on a wafer side of the package. Because of their small size, multiple nanospikes make contact with a single pad/solderball on the semiconductor device. In some embodiments, after detecting that the device under test passes the test, the device under the test can be packaged to create a known good die in a package.
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