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Apparatus and method for making sputtered films with reduced stress asymmetry
Apparatus and method for making sputtered films with reduced stress asymmetry
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机译:用于制造具有减小的应力不对称性的溅射膜的设备和方法
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摘要
Certain example embodiments of this invention relate to techniques for reducing stress asymmetry in sputtered polycrystalline films. In certain example embodiments, sputtering apparatuses that include one or more substantially vertical, non-conductive shield(s) are provided, with such shield(s) helping to reduce the oblique component of sputter material flux, thereby promoting the growth of more symmetrical crystallites. In certain example embodiments, the difference between the travel direction tensile stress and the cross-coater tensile stress of the sputtered film preferably is less than about 15%, more preferably less than about 10%, and still more preferably less than about 5%.
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